分板前做ICT只要排一整片主板(3pcs一片)，效率会高一点；如果是分

To do ICT before splitting the board, you only need to line up a whole motherboard (3pcs), the efficiency will be higher; if it is to split the board and then test the ICT, you need to place the motherboard 3 times (because the motherboard has been split). <br>ICT pallets are divided into pallets (for use as a whole piece) and maintenance pallets (for single piece use after dividing the board).

ICT in front of the board as long as a full board (3pcs a piece), the efficiency will be a little higher, if it is a sub-board after ICT testing, you need to swing the motherboard 3 times (because the motherboard has been sub-boarded).<br>ICT pallets we divide into pallets (whole plate use) and service pallets (single-piece use after the plate is divided).

Before the board is divided, it is only necessary to arrange a whole motherboard (3pcs) for ICT test, and the efficiency will be higher. If the board is divided before ICT test, the motherboard needs to be placed three times (because the motherboard has been divided).<br>ICT pallets are divided into pallets (used in whole piece) and maintenance pallets (used in single piece after separated board).