CPU芯片点胶。使用点胶设备对模块CPU芯片施胶（路径如图1红色箭头标

CPU chip dispensing. <br>Use dispensing equipment to apply glue to the module CPU chip (the path is indicated by the red arrow in Figure 1), and the glue time is controlled at 5-8S (from the beginning of the glue application to the completion of the <br><br>glue ). The edge devices are glued to the <br>left side of the CPU and the empty devices R395, C92 , R394, U10 position number empty pads are filled with glue on the bottom, (as shown in the left box position of Figure 1). <br><br>1. After the glue is dispensed, the main board is left to ensure that the glue overflows around the chip. It must be cured within 15-20 minutes after sizing. <br>2. It is necessary to reconfirm whether the glue overflow of the chip meets the requirements before curing (there is glue overflow around the chip). <br>3. The pressure parameter of the glue dispensing machine is set to 0.1-0.3Mpa

CPU chip adhesive.<br>The module CPU chip is glued using the dosing device (path is indicated by the red arrow in Figure 1), and the application time is controlled at 5-8S (the application starts to finish) <br><br>Edge device adhesive<br>The device R395, C92, R394, and U10-bit empty pad point on the left side of the CPU are filled with glue at the bottom (box position on the left side of Figure 1).<br><br>1. After unpening the motherboard sit-in to ensure that the chip around the full overflow of glue. After adhesive, curing is necessary within 15-20 minutes. <br>2. Before curing, it is necessary to confirm whether the chip overflow condition meets the requirements (there is overflow around the chip).<br>3． The adhesive air pressure parameter of the dosing machine is set to 0.1-0.3Mpa

CPU chip dispensing.<br>Use the dispensing device to glue the CPU chip of the module (the path is indicated by the red arrow in Figure 1), and the sizing time is controlled within 5-8s (from the beginning of sizing to the completion of sizing)<br>Edge device dispensing<br>The devices r395, C92, r394 and U10 on the left side of CPU are empty soldered with underfill (as shown in the box on the left side of Figure 1).<br>1. After dispensing, the motherboard is still to ensure that the chip is fully overflowed. It must be cured within 15-20 minutes after sizing.<br>2. Before curing, it is necessary to reconfirm whether the chip overflow meets the requirements (there is overflow around the chip).<br>3. The pressure parameter of dispensing machine is set to 0.1-0.3mpa