从上到下，从左至右检查主板外观，检查内容：1.主板弹片有无变形；2.标

从上到下，从左至右检查主板外观，检查内容：1.主板弹片有无变形；2.标签贴附位置是否正确，是否褶皱；3.金手指是否脏污、沾锡；4.纽扣电池焊接情况，有无搭锡、虚焊、短路、破皮等；5.CPU芯片点胶情况（是否固化、气泡、溢胶以及接触到旁边元器件等）；6. KEYMESH贴附情况，有无歪斜、破损、脏污。7.其他主板外观，是否有锡珠、锡渣残留等。

0/5000

源语言: -

目标语言: -

结果 (英语) 1: [复制]

复制成功！

Check the appearance of the motherboard from top to bottom, from left to right, and check the content: 1. Whether the motherboard shrapnel is deformed; 2. Whether the label is attached in the correct position and whether it is wrinkled; 3. Whether the golden finger is dirty or tinted; 4. Button The battery welding condition, whether there is tin bonding, virtual soldering, short circuit, broken skin, etc.; 5. CPU chip dispensing condition (whether solidified, air bubbles, glue overflow, and contact with nearby components, etc.); 6. KEYMESH attachment condition, yes No skew, damage, or dirt. 7. The appearance of other motherboards, whether there are tin beads, tin residue, etc.

正在翻译中..

结果 (英语) 2:[复制]

复制成功！

From top to bottom, check the appearance of the motherboard from left to right and check the contents: 1. Is there deformation of the motherboard shrapnboard? 2. Whether the label is attached in the correct position, whether the folds; 3. Whether gold fingers are dirty or tinned; 4. Button battery welding situation, there is no tin, virtual welding, short circuit, broken skin, etc. 5. CPU chip dosing situation (whether curing, bubbles, spillage and contact with next to the components); 6. KEYMESH attachment, there are skewed, broken, dirty. 7. Other motherboard appearance, whether there are tin beads, tin residue, etc.

正在翻译中..

结果 (英语) 3:[复制]

复制成功！

Check the appearance of the motherboard from top to bottom and from left to right 1. Whether the main board shrapnel is deformed; 2. Whether the label is attached correctly and wrinkled; 3. Whether the golden finger is dirty and stained with tin; 4. Button battery welding conditions, whether there is tin bonding, false soldering, short circuit, broken skin, etc; 5. Glue dispensing of CPU chip (whether it is cured, bubbles, overflow and contact with nearby components, etc.); 6. Keymesh attachment, whether there is skew, damage, dirt. 7. The appearance of other mainboards, whether there are tin beads and slag residues.

正在翻译中..

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