为了避免器件撞件导致整机不良，分板后进行ICT测试需要排放3pcs没有

In order to avoid component collisions and lead to bad machine, the ICT test needs to discharge 3pcs after the board is divided, and it is easier to hit the parts without the pcb process. We suggest to split the board after the ICT test (panel form) is completed.

In order to avoid the device collision caused by the machine bad, after the sub-board ICT test needs to discharge 3pcs without pcb process edge more easily bump. We recommend that the ICT test (panel pattern) be completed before the split plate is completed.

In order to avoid the bad performance of the whole machine caused by device bumping, it is necessary to discharge 3pcs for ICT test after splitting, and it is easier to bump the parts without PCB process edge. We suggest that the board should be divided after the completion of ICT test (panel form).<br>