CPU芯片点胶。使用点胶设备对模块CPU芯片施胶（路径如图1红色箭头标

CPU chip dispensing. <br>Use glue dispensing equipment to apply glue to the module CPU chip (the path is indicated by the red arrow in Figure 1), and the glue time is controlled at 5-8S (from the beginning to the completion of glue application). <br><br>Dispensing glue for edge devices <br>on the empty pads of R395, C92, R394, and U10 on the left side of the CPU, and place the underfill on the empty pads (as shown in the left box position of Figure 1). <br><br>1. After the glue is dispensed, the main board is left to ensure that the glue overflows around the chip. It must be cured within 15-20 minutes after sizing. <br>2. It is necessary to reconfirm whether the glue overflow of the chip meets the requirements before curing (there is glue overflow around the chip). <br>3. The pressure parameter of the glue dispensing machine is set to 0.1-0.3Mpa

CPU chip adhesive.<br>The module CPU chip is glued using the dosing device (the path is indicated by the red arrow in Figure 1), and the application time is controlled at 5-8S (starting to finish). <br><br>Edge device adhesive<br>The device R395, C92, R394, and U10-bit empty pad point on the left side of the CPU are filled with glue at the bottom (box position on the left side of Figure 1).<br><br>1. After unpening the motherboard sit-in to ensure that the chip around the full overflow of glue. After adhesive, curing is necessary within 15-20 minutes. <br>2. Before curing, it is necessary to confirm whether the chip overflow condition meets the requirements (there is overflow around the chip).<br>3． The adhesive air pressure parameter of the dosing machine is set to 0.1-0.3Mpa

CPU chip dispensing.<br>Use the dispensing device to glue the CPU chip of the module (the path is indicated by the red arrow in Figure 1), and the sizing time is controlled within 5-8s (from the beginning of sizing to the completion of sizing).<br>Edge device dispensing<br>The devices r395, C92, r394 and U10 on the left side of CPU are empty soldered with underfill (as shown in the box on the left side of Figure 1).<br>1. After dispensing, the motherboard is still to ensure that the chip is fully overflowed. It must be cured within 15-20 minutes after sizing.<br>2. Before curing, it is necessary to reconfirm whether the chip overflow meets the requirements (there is overflow around the chip).<br>3. The pressure parameter of dispensing machine is set to 0.1-0.3mpa